Suitable for OCA,OCF,TPF,COF,SCA and other hot melt adhesive process of medium and large size G+G full bonding, OCA process of size G+G, suitable for naked eye 3D and TP/LCM all types of full bonding.

Equipment is customized equipment, according to different processes for the function of customization

platform size 1300*2250mm

Device dimensions (L x W x H) mm about 3600*2880*2500

Machine type vertical

Weighs about 7500 kg

Supply and demand three-phase 380V/ 50HZ power 30KW

Environmental requirements clean, dust-free, clean room (CLASS100)

Grounding requirements The grounding of the ESD plug must be separate from that of the power plug

Working pressure/pipe diameter 4 ~ 6bar

Dry gas source ф12

Machine parts and surface treatment

Rack surface powder treatment: computer white color, other parts chrome plating or oxidation treatment

The safety specification shall be implemented in accordance with < AVBU equipment Safety Specification V.2 >